Gigabyte B560M DS3H Intel LGA 1200 10th-11th Gen Motherboard | B560M-DS3H

GIGABYTE B760 Motherboards are ready to work with the PCIe 4.0 devices which are expected to experience triple bandwidth than the current PCIe 3.0 devices. To reach the high speed and maintain good signal integrity, GIGABYTE R&D uses the low impedance PCB to provide the maximum performance.

– 6+2+1 Phases Hybrid Digital VRM Design
– 6+2+1 Phases Low RDS(on) MOSFETs
– Premium Choke and Capacitors to improve transient response and minimize oscillation
GIGABYTE B760 Motherboards
are ready to work with the PCIe 4.0 devices which are expected to experience triple bandwidth than the current PCIe 3.0 devices. To reach the high speed and maintain good signal integrity, GIGABYTE R&D uses the low impedance PCB to provide the maximum performance.
Shielded Memory Routing
All memory routing is under the PCB inner layer shielded by a large ground layer to protect from external interference.
GIGABYTE Ultra-Efficient M.2 Thermal Guard
With durability in mind, GIGABYTE provides a thermal solution for M.2 SSD devices. The M.2 Thermal Guard prevents throttling and bottlenecks from high speed M.2 SSDs as it helps to dissipate heat before it becomes an issue.
Cooling Features
– High Current Support
Each fan headers support PWM and DC fan and Water Cooling Pump , and up to 24W (12V x 2A) with Over-Current Protection
– Precision Control
Multiple temperature/fan speed control points for precise fan curve
– Dual Curve Mode
Slope/Stair dual mode for different user scenario
– Fan Stop
Fan can stop completely below users’ specified temperature point